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, “Effect of additives on the co-electrodeposition of Sn-Ag-Cu lead-free solder composition”, Materials Science and Engineering B-Advanced Functional Solid-State Materials, vol. 168, no. 1-3, pp. 219-223, 2010.
, “Role of additives in chiral amine-catalyzed direct aldol reaction”, Synthetic Communications, vol. 44, no. 3, pp. 352-360, 2014.
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