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“PEEK/SiO2 composites with high thermal stability for electronic applications”, Electronic Materials Letters, vol. 9, no. 1, pp. 95-100, 2013.
, “Fabrication, thermal and electrical properties of polyphenylene sulphide/copper composites”, Materials Chemistry and Physics, vol. 128, no. 1-2 , pp. 114-120, 2011.
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