Fluoride release and fluoride-recharging ability of three different sealants

TitleFluoride release and fluoride-recharging ability of three different sealants
Publication TypeJournal Article
Year of Publication2020
AuthorsPatil, S, Kontham, UR, Kontham, RK, Patil, SS, Kamble, SP
JournalJournal of Indian Society of Pedodontics and Preventive Dentistry
Volume38
Issue3
Pagination247-252
Date PublishedJUL
Type of ArticleArticle
Abstract

Background: We aimed to determine the fluoride release and fluoride-recharging ability of a sealant containing surface pre-reacted glass (S-PRG) ionomer filler particles (BeautiSealant) with a fluoride-releasing resin sealant (Helioseal F), and a glass-ionomer sealant (Fuji VII). Materials: And: Methodology: Forty-eight disc-shaped specimens of each material were immersed in deionized water to determine the fluoride release utilizing a fluoride ion-selective electrode. After 21 days, 8 specimens were soaked in 0.22% Sodium Fluoride solution for 2 min; 8 specimens were coated with 1.23% Acidulated Phosphate Fluoride (APF) gel for 4 min, and the fluoride-recharging ability was evaluated for 40 days. Data were analyzed using one way-ANOVA and Bonferroni post hoc tests. Results: Total fluoride release over the 21-day period was: Fuji VII > BeautiSealant > Helioseal F, (P = 0.000). After refluoridation of the specimens with 0.22% Sodium Fluoride solution, the cumulative fluoride release during the 40-day period for each material was: BeautiSealant > Fuji VII > Helioseal (P = 0.000). After exposure to 1.23% APF gel, the cumulative fluoride release during the 40-day period for each material was: BeautiSealant > Fuji VII > Helioseal F (P = 0.000). Conclusion: Glass ionomer-based sealants (Fuji VII) exhibited higher initial fluoride release whilst the surface pre-reacted glass-ionomer filler containing sealant (BeautiSealant) demonstrated superior fluoride recharging properties.

DOI10.4103/JISPPD.JISPPD_345_19
Type of Journal (Indian or Foreign)

Foreign

Impact Factor (IF)

NA

Divison category: 
Chemical Engineering & Process Development

Add new comment