<?xml version="1.0" encoding="UTF-8"?><xml><records><record><source-app name="Biblio" version="7.x">Drupal-Biblio</source-app><ref-type>17</ref-type><contributors><authors><author><style face="normal" font="default" size="100%">Goyal, R. K.</style></author><author><style face="normal" font="default" size="100%">Rokade, K. A.</style></author><author><style face="normal" font="default" size="100%">Kapadia, A. S.</style></author><author><style face="normal" font="default" size="100%">Selukar, B. S.</style></author><author><style face="normal" font="default" size="100%">Garnaik, Baijayantimala</style></author></authors></contributors><titles><title><style face="normal" font="default" size="100%">PEEK/SiO2 composites with high thermal stability for electronic applications</style></title><secondary-title><style face="normal" font="default" size="100%">Electronic Materials Letters</style></secondary-title></titles><keywords><keyword><style  face="normal" font="default" size="100%">hardness</style></keyword><keyword><style  face="normal" font="default" size="100%">PEEK</style></keyword><keyword><style  face="normal" font="default" size="100%">polymer matrix composites</style></keyword><keyword><style  face="normal" font="default" size="100%">Thermal properties</style></keyword></keywords><dates><year><style  face="normal" font="default" size="100%">2013</style></year><pub-dates><date><style  face="normal" font="default" size="100%">JAN</style></date></pub-dates></dates><number><style face="normal" font="default" size="100%">1</style></number><publisher><style face="normal" font="default" size="100%">KOREAN INST METALS MATERIALS</style></publisher><pub-location><style face="normal" font="default" size="100%">POSCO CENTER, 4TH FL (EAST WING), 892 DAECHI-4-DONG, KANGNAM-KU, SEOUL 135-777, SOUTH KOREA</style></pub-location><volume><style face="normal" font="default" size="100%">9</style></volume><pages><style face="normal" font="default" size="100%">95-100</style></pages><language><style face="normal" font="default" size="100%">eng</style></language><abstract><style face="normal" font="default" size="100%">&lt;p&gt;Thermal and mechanical properties of new high performance polymer matrix composites based on poly(etheretherketone) (PEEK) as matrix and crystalline-silica (SiO2) as reinforcement were discussed for application in electronic packaging substrates or printed circuit boards. The content of SiO2 was varied between 0 and 50 wt. %. Scanning electron microscopy showed uniform dispersion of SiO2 particles in the matrix. Thermogravimetry analysis showed significant increase in thermal stability and char yield with increase in SiO2 content in the matrix. Differential scanning calorimetry showed that SiO2 had a heterogeneous nucleating effect on PEEK, leading to an increase in peak temperature of crystallization and onset crystallization temperature of the composites compared to a pure matrix. The microhardness increased approximately 42%. A modified rule of mixtures with a strengthening efficiency factor equal to 0.06 fit the data nicely. The results show that the prepared PEEK/SiO2 composites may have potential applications in electronics.&lt;/p&gt;</style></abstract><issue><style face="normal" font="default" size="100%">1</style></issue><custom3><style face="normal" font="default" size="100%">Foreign
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