02004nas a2200217   4500008004100000022001400041245009300055210006900148260007300217300001200290490000800302520123300310653001401543653002201557653001301579653001901592653001701611100001801628700002301646856011701669       2010                        eng d  a0921-510700aEffect of additives on the co-electrodeposition of Sn-Ag-Cu lead-free solder composition0 aEffect of additives on the coelectrodeposition of SnAgCu leadfre  aPO BOX 211, 1000 AE AMSTERDAM, NETHERLANDSbELSEVIER SCIENCE BVcAPR  a219-2230 v1683 a<p>We have developed a methane sulfonic acid (MSA) based ternary electrodeposition bath for the deposition of near eutectic Sn-Ag-Cu films aimed at solder bumping applications in electronics. The bath contains thiourea as chelating agent and iso-octyl phenoxy ethanol (OPPE) as surfactant. We added gelatin to this bath and studied its effect on bath stability, microstructure of the deposited films and the film composition. It is found that the bath containing both the additives, viz. OPPE and gelatin, show improved stability up to 8-10 days. Striking improvement in the film microstructure, in terms of the compactness, uniformity and refinement of grains was found when the bath contained these additives. Detailed electrochemical studies with the help of cyclic voltametry and impedance analysis helped in understanding the role played by these additives during deposition. It is confirmed that there is a formation of loosely connected, highly non-uniform passivating film on the cathode surface, which is removed competitively by the depositing metal ions during the deposition. It is also clear that the additives play a role in the formation of such a passivating film. (C) 2010 Elsevier B.V. All rights reserved.</p>10aAdditives10aLead-free solders10aSn-Ag-Cu10aSolder bumping10aTernary bath1 aJoseph, Shany1 aPhatak, Girish, J.  uhttps://library.ncl.res.in/content/effect-additives-co-electrodeposition-sn-ag-cu-lead-free-solder-composition-0