02151nas a2200253   4500008004100000022001400041245009500055210006900150260006900219300001200288490000800300520125700308653002401565653002801589653001301617653002201630100001801652700002001670700001701690700002001707700002201727700002101749856012701770       2011                        eng d  a0254-058400aFabrication, thermal and electrical properties of polyphenylene sulphide/copper composites0 aFabrication thermal and electrical properties of polyphenylene s  aPO BOX 564, 1001 LAUSANNE, SWITZERLANDbELSEVIER SCIENCE SAcJUL  a114-1200 v1283 a<p>The thermal and electrical properties of high performance poly(phenylene sulphide) (PPS) composites reinforced up to 31 vol% Cu particles were investigated to be used as materials for electronic applications. The thermal stability and char yield of the composites increased significantly. Both pre- and post- glass transition coefficient of thermal expansion (CTE) of composites decreased significantly. The microhardness was increased by more than 50% compared to pure PPS matrix. Microhardness and CTE of composites correlated well with the rule of mixtures. A percolation threshold about 6 vol% Cu was obtained. The electrical conductivity was increased by about eight orders of magnitude for 18 vol% composite. Dielectric constant and dissipation factor of composites at 1 MHz was increased by about 6-fold and 70-fold compared to matrix, respectively. They decreased gradually with increasing frequency up to 1 MHz and thereafter, there was insignificant change. The scanning electron microscope showed almost uniform distribution of Cu particles in the matrix. Owing to better dimensional stability and good electrical properties, these composites are very promising for electronic applications. (C) 2011 Elsevier B.V. All rights reserved.</p>10aDielectric property10aElectrical conductivity10ahardness10aThermal expansion1 aGoyal, R., K.1 aKambale, K., R.1 aNene, S., S.1 aSelukar, B., S.1 aArbuj, Sudhir, S.1 aMulik, Uttam, P.  uhttps://library.ncl.res.in/content/fabrication-thermal-and-electrical-properties-polyphenylene-sulphidecopper-composites-001941nas a2200241   4500008004100000022001400041245008100055210006900136260013100205300001100336490000600347520105800353653001301411653000901424653003001433653002301463100001801486700001901504700002001523700002001543700002801563856010801591       2013                        eng d  a1738-809000aPEEK/SiO2 composites with high thermal stability for electronic applications0 aPEEKSiO2 composites with high thermal stability for electronic a  aPOSCO CENTER, 4TH FL (EAST WING), 892 DAECHI-4-DONG, KANGNAM-KU, SEOUL 135-777, SOUTH KOREAbKOREAN INST METALS MATERIALScJAN  a95-1000 v93 a<p>Thermal and mechanical properties of new high performance polymer matrix composites based on poly(etheretherketone) (PEEK) as matrix and crystalline-silica (SiO2) as reinforcement were discussed for application in electronic packaging substrates or printed circuit boards. The content of SiO2 was varied between 0 and 50 wt. %. Scanning electron microscopy showed uniform dispersion of SiO2 particles in the matrix. Thermogravimetry analysis showed significant increase in thermal stability and char yield with increase in SiO2 content in the matrix. Differential scanning calorimetry showed that SiO2 had a heterogeneous nucleating effect on PEEK, leading to an increase in peak temperature of crystallization and onset crystallization temperature of the composites compared to a pure matrix. The microhardness increased approximately 42%. A modified rule of mixtures with a strengthening efficiency factor equal to 0.06 fit the data nicely. The results show that the prepared PEEK/SiO2 composites may have potential applications in electronics.</p>10ahardness10aPEEK10apolymer matrix composites10aThermal properties1 aGoyal, R., K.1 aRokade, K., A.1 aKapadia, A., S.1 aSelukar, B., S.1 aGarnaik, Baijayantimala  uhttps://library.ncl.res.in/content/peeksio2-composites-high-thermal-stability-electronic-applications-0