@article { ISI:000278307300038,
	title = {Effect of additives on the co-electrodeposition of Sn-Ag-Cu lead-free solder composition},
	journal = {Materials Science and Engineering B-Advanced Functional Solid-State Materials},
	volume = {168},
	number = {1-3, SI},
	year = {2010},
	note = {Conference on Specialty Advanced Materials and Polymers for Aerospace and Defense and Applications (SAMPADA-2008), Mat Res Soc Singapore, Singapore, SINGAPORE, JUL 03-08, 2005},
	month = {APR},
	pages = {219-223},
	publisher = {ELSEVIER SCIENCE BV},
	address = {PO BOX 211, 1000 AE AMSTERDAM, NETHERLANDS},
	abstract = {<p>We have developed a methane sulfonic acid (MSA) based ternary electrodeposition bath for the deposition of near eutectic Sn-Ag-Cu films aimed at solder bumping applications in electronics. The bath contains thiourea as chelating agent and iso-octyl phenoxy ethanol (OPPE) as surfactant. We added gelatin to this bath and studied its effect on bath stability, microstructure of the deposited films and the film composition. It is found that the bath containing both the additives, viz. OPPE and gelatin, show improved stability up to 8-10 days. Striking improvement in the film microstructure, in terms of the compactness, uniformity and refinement of grains was found when the bath contained these additives. Detailed electrochemical studies with the help of cyclic voltametry and impedance analysis helped in understanding the role played by these additives during deposition. It is confirmed that there is a formation of loosely connected, highly non-uniform passivating film on the cathode surface, which is removed competitively by the depositing metal ions during the deposition. It is also clear that the additives play a role in the formation of such a passivating film. (C) 2010 Elsevier B.V. All rights reserved.</p>},
	keywords = {Additives, Lead-free solders, Sn-Ag-Cu, Solder bumping, Ternary bath},
	issn = {0921-5107},
	doi = {10.1016/j.mseb.2010.01.017},
	author = {Joseph, Shany and Phatak, Girish J.}
}
